The Impact of Component Packaging (Tape & Reel, Tray, Tube) on Feeders

05-06 | KingshengPCBA

This article analyzes the specific effects of three common packaging types—tape & reel, tray, and tube—on feeders.


Moisture Sensitive Device (MSD) Control and Baking Specifications

05-06 | KingshengPCBA

This article outlines the core operating procedures for MSD control and baking from incoming inspection to pre-placement.


Class II Medical Device PCB Prototyping Pitfall Guide: 3 Core Risk Zones + 4 Key Control Points

05-06 | KingshengPCBA

Shenzhen Kingsheng PCBA draws on 10 years of experience in Class II medical device PCB services to present this pitfall guide — helping manufacturers avoid 90% of common issues.


How High Is the Barrier for Automotive Electronics PCBA? A Third-Party Technical Perspective on Core Requirements for Automotive-Grade Manufacturing

05-06 | KingshengPCBA

A Third-Party Technical Perspective on Core Requirements for Automotive-Grade Manufacturing.


Why Is Industrial PCBA Stability Hard to Guarantee? A Third-Party Technical Perspective: Four Core Pillars of High-Reliability Manufacturing

05-06 | KingshengPCBA

A Third-Party Technical Perspective: Four Core Pillars of High-Reliability Manufacturing


Causes of Component Displacement in SMT Assembly

05-06 | KingshengPCBA

Component shift stems from multi-factor SMT issues; prevention via process/equipment/material control is key


The Role and Professional Setup of Reflow Soldering Temperature Curves in SMT Assembly

05-06 | KingshengPCBA

Reflow temp curve optimization boosts yield & reliability; verify per shift


First Article Inspection Process in SMT Assembly

05-06 | KingshengPCBA

FAI ensures SMT quality via standardized, intelligent, traceable systems


Ultra-Thin PCBs: Overcoming Thinness Challenges

05-06 | KingshengPCBA

Key challenges of ultra-thin PCBs (≤0.5mm) include manufacturing complexities, yield drops to 70-85%, and the need for specialized materials/processes, making partner selection critical for reliability in wearables and medical devices


What Defects Can AOI Detect?

05-05 | KingshengPCBA

AOI uses high-resolution cameras to capture images of the circuit board and compares them against a golden template to identify various appearance and soldering defects. Below are the main defect categories detectable by AOI.


Spray, Dip, or Brush: Choosing the Right Conformal Coating Process

05-05 | KingshengPCBA

This article compares spray, dip, and brush coating methods from four perspectives: operating principles, process advantages, limitations, and selection recommendations.


How to Avoid Bubbles and Capillary Action in Conformal Coating

05-05 | KingshengPCBA

Bubbles can lead to reduced insulation performance, while capillary action may contaminate connectors, switches, or test points. The following methods address these issues from two perspectives: process control and material selection.


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