First Article Inspection Process in SMT Assembly

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In the SMT assembly process, FAI(first article inspection) is a critical step to ensure production quality. By conducting a comprehensive and meticulous inspection of the first batch of products, it enables the timely detection and correction of potential issues, preventing the occurrence of mass defects. The detailed FAI process in SMT assembly is as follows:



I. Preparation Phase
Document Preparation: The Production Department, Engineering Department, and Quality Department must jointly verify the accuracy of the documentation. Any discrepancies should be promptly reported and confirmed with the customer to ensure all documents align with production requirements.
Material Preparation: Based on the Bill of Materials (BOM), prepare the required components and PCBs. Screen all SMT components to be soldered to ensure their quality meets the required standards.
Equipment Setup: Perform setup and calibration on key equipment such as the SMT pick-and-place machine and reflow soldering machine. This includes adjusting parameters like temperature, time, and pressure to ensure stability and consistency during the soldering process.

II. First Article Production & Preliminary Inspection

First Article Production: Produce the first article according to the production process. This typically includes steps such as solder paste printing, Solder Paste Inspection (SPI), component placement, and reflow soldering.
Preliminary Visual Inspection: Conduct a visual inspection of the soldered PCB to confirm that components are correctly mounted on the board, with no misalignment, no cold joints, no solder bridges, and other defects.

III. Detailed Inspection & Testing
LCR Testing: Perform placement verification and LCR (Inductance, Capacitance, Resistance) testing on chip resistors, capacitors, and inductors. This includes measuring parameters such as resistance, capacitance, and inductance to ensure the component's electrical characteristics meet the design requirements.
Electrical Testing: Use electrical testing to check the conductivity of each solder joint, ensuring current can flow smoothly.
X-ray or Ultrasonic Inspection:  For multi-layer PCBs or components difficult to inspect visually, such as Ball Grid Arrays (BGAs), employ X-ray or ultrasonic inspection equipment to examine the internal structures.
Functional Testing: After completing the above inspections, perform functional testing on the first article to ensure it operates correctly under actual working conditions.
Functional testing should be conducted using professional testing equipment and software to guarantee the accuracy and reliability of the results.



IV. Issue Documentation & Feedback
Issue Documentation: If any issues are identified during the inspection process, they must be documented in detail, including the type of defect, location, severity, and other relevant information. This facilitates subsequent problem analysis and corrective actions.

Issue Feedback: Timely feedback on the issues identified during inspection should be provided to relevant departments such as Production and Engineering, requiring responsible management personnel to implement corrective actions immediately.

V. First Article Approval & Mass Production
First Article Approval: After the first article has undergone comprehensive inspection and is confirmed to be qualified, the Quality Department signs off on the PCBA First Article Approval Form. They also fill in the details for the first article sample label and its storage location. The first article sample must be stored in a designated area on the production line to serve as a reference for subsequent production.
Mass Production: Mass production can only commence after the first article is approved. Throughout the production process, continuous quality monitoring is essential to ensure that subsequent products maintain the same quality level as the approved first article.

As a company deeply engaged in the SMT assembly field, Kingsheng PCBA recognizes the core value of FAI in quality control. We have established FAI system that integrates "standardized processes, intelligent tools, and full-process traceability," helping our customers mitigate batch risks at the source..

With 17 years of expertise in PCBA design, manufacturing, and service, KingshengPCBA is ready to help turn your ideas into reality. Feel free to contact us anytime to discuss your requirements and get a professional quotation.