The Basic Cause of PCBA Tin Beads and Slags

02-18 | Industry

During the PCBA (Printed Circuit Board Assembly) manufacturing process, factors such as procedural issues and manual operations can lead to the occasional presence of solder beads (tin beads) and dross. These residues pose significant risks to ...


Methods of Preventing Welding Porosity in PCBA Factory

02-18 | Industry

Bubbles are commonly generated during the reflow and wave soldering processes in SMT chip production. These bubbles can adversely affect not only the appearance of the PCB assembly (PCBA) but also the overall quality of the final products.


Dimensions of PCBA pads and design defects of chip components

02-18 | Industry

An essential aspect of PCBA (Printed Circuit Board Assembly) design is the SMT (Surface Mount Technology) pad. The pad's design determines the positioning of components on the PCBA and directly impacts the reliability of solder joints ...


Main Causes and Countermeasures of PCBA Dumping

02-18 | Industry

While it is normal for a placement machine to experience occasional PCBA dumping, a high rate of such occurrences can significantly impact production efficiency and costs. In cases of frequent dumping, it is advisable to consult on-site personnel ...


Multi-layer PCB Stack Structure

01-11 | Industry

Determining the stacked structure of a multilayer PCB involves various factors. From a wiring perspective, having more layers generally improves the routing capability. However, this increase comes with higher costs and greater manufacturing complexit


PCBA Manufacturing Needs in the Medical Industry

01-11 | Industry

As the aging population continues to grow, the role of PCB (printed circuit board) manufacturing in the medical industry will become increasingly important. PCBs are essential components in various medical devices, such as MRI machines and cardiac ...


Introductory Tutorial for Multilayer PCB Design

01-11 | Industry

Before designing a multi-layer PCB circuit board, PCB layout engineers must determine the board's structure based on the circuit scale, board size, and electromagnetic compatibility (EMC) requirements. This will involve deciding whether to use a 4-lay


High Density Circuit Board Technology and Application

01-11 | Industry

High-density circuit board technology is a crucial aspect of modern circuit board design and manufacturing. It enables the integration of more circuit components into a smaller physical space, resulting in higher performance. This article discusses...


PCB Layout Of The Power Circuit

01-11 | Industry

The power circuit is a crucial component of an electronic product, and its design directly impacts the product's performance. Our electronic products primarily utilize linear power supplies and high-frequency switching power supplies.


PCB Reverse Engineering - KingSheng PCBA

01-11 | Industry

PCB (Printed Circuit Board) reverse engineering involves analyzing existing electronic products and their circuit boards to recreate technical documents such as PCB files, Bills of Materials (BOM), and schematic files. The process allows for a 1:1 ..


Solutions of White Spots in PCBA Processing

01-10 | Industry

It is common for certain PCBA processed products to develop white spots. This phenomenon typically occurs during the soldering or cleaning process and appears as white spots or residues on or around the surface of the printed circuit board


PCB Design For LED Switching Power Supply

01-10 | Industry

In the early stages of designing electronic equipment, the circuit schematic must be accurately designed. Any problems in the PCB design can hurt the equipment's reliability. Therefore, the correct approach must be used in the PCB board design.


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