04-18 | Industry
older paste plays a crucial role in the assembly of printed circuit boards (PCBs).lt is used to create solder joints between the electronic compo-nents and the printed circuit boards. Solder paste is typically applied to the PCBs using a SMT stencil.
04-18 | Industry
In the PCB reverse technology research, the anti-push schematic diagram is based on the PCB file diagram or directly based on the product directly depicts the PCB circuit diagram, designed to explain the principle and work of the PCB circuit board.
04-18 | Industry
PCBA processing BGA welding spot is not full solution, 1. Printing sufficient amount of solder paste; 2. Use resistance welding to cover the holes to avoid solder loss;
04-11 | Industry
This circuit board manufacturer is a professional PCBA chip processor with extensive production and processing experience. Below are the essential requirements for varistors in PCBA design: 1. Operating and Storage Temperature; 2. Applied Voltage...
04-11 | Industry
In the process of PCBA welding, the molten liquid filler metal needs to spread over the metal surface so that metal atoms can come into proximity. Therefore, achieving wetting of the weldment’s surface with molten filler metal is a primary requireme
04-11 | Industry
The systematic quality control of solder paste printing and reflow temperature management during SMT chip processing are crucial stages in the PCBA manufacturing process. For the production of high-precision circuit boards with special and complex...
04-11 | Industry
The included angle of the scraper in the electronic processing and production process affects the vertical force exerted by the scraper on the solder paste. A smaller included angle increases the vertical component of the force. When the scraper angle
04-11 | Industry
The size of a printed circuit board (PCB) is limited by the capabilities of the electronic processing production line equipment. Therefore, it is essential to consider the appropriate PCB size during product design.
03-22 | Industry
During the PCBA (Printed Circuit Board Assembly) processing, factors related to the manufacturing process and manual operations can lead to the occurrence of solder beads and dross on the PCBA board. These issues pose significant risks, as loose ...
03-22 | Industry
Bubbles are typically generated during the reflow and wave soldering processes in SMT chip manufacturing. These bubbles can not only detract from the visual appeal of the PCBA but also compromise the overall quality of the products. To prevent solder.
03-22 | Industry
While it is normal for the placement machine to experience some PCBA rejection, a high rate of such incidents can significantly affect production efficiency and costs. If there is a serious issue with PCBA rejection, consult on-site personnel and...
03-22 | Industry
SMT (Surface Mount Technology) welding is a vital part of the assembly process for electronic devices. Without proper quality assurance in the SMT welding process, even the best-designed electronic equipment may fail to meet its design objectives.
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