Top Configurations in SMT Production Line—Twelve-zone Lead-free Nitrogen Reflow Soldering Oven

09-10 | KingshengPCBA

Currently, twelve-zone lead-free nitrogen reflow soldering is one of the Top Configurations in SMT (Surface Mount Technology) production lines, which is backed by a comprehensive consideration of high quality, high reliability, high efficiency...


Necessity and Time of Baking Materials Before SMT Assembly

09-10 | KingshengPCBA

During the Surface Mount Technology (SMT) assembly process of PCBA, pre-baking certain specific materials before placement is a crucial pre-treatment step to ensure soldering quality and the long-term reliability of electronic products. The primary...


Micrometer-Level Precision: PCB Back Drilling Technology for High-Speed Signal Integrity

09-10 | KingshengPCBA

Amidst the pursuit of high speed and high frequency in modern electronic equipment, the precision of tiny holes on printed circuit boards (PCBs) has become a critical factor impacting signal integrity. Back drilling technology is a precision process..


Buried and Blind Via Technology: The Precision Art of Modern Electronic Manufacturing

09-10 | KingshengPCBA

In the rapidly developing electronics industry, buried and blind via technology has become one of the core processes in high-density interconnect (HDI) printed circuit board (PCB) manufacturing. It significantly enhances the integration and...


Incoming Quality Control (IQC) Process & Handling of Rejected Incoming Materials

09-10 | KingshengPCBA

Before PCBA (Printed Circuit Board Assembly) production, Kingsheng PCBA regards Incoming Quality Control (IQC) as the first crucial quality control checkpoint. The primary objective is to ensure that all materials entering production comply with...


Small Process, Great Impact: Dry Ice Cleaning

09-10 | KingshengPCBA

Dry ice cleaning, also known as low-temperature blasting or carbon dioxide blasting, is a highly efficient, dry, non-abrasive, and environmentally friendly cleaning technology. Its core principle can be summarized as the triple action...


Requirements For PCB Assembly Materials

09-10 | KingshengPCBA

(1) Good stability and reliability of solder paste. The content of harmful impurities is strictly controlled for the solder; low residue and non-corrosive for the solder paste and flux; the bonding strength is not high or low for the bonding agent,


Precise THT Manufacture-Selective Wave Soldering

09-10 | KingshengPCBA

In the evolution of electronic manufacturing processes, selective wave soldering technology, by virtue of its precise and efficient characteristics, has become an indispensable key process in high-end manufacturing. Unlike the "full coverage" mode...


Technological Evolution from Stencil Improvement to Vacuum Reflow Soldering: Addressing Voids Issues in Bottom-Contact Components

09-10 | KingshengPCBA

In the field of electronic manufacturing, the increasing precision of Surface Mount Technology (SMT) continuously drives process innovation. Particularly for bottom-contact components (e.g., BGA, LGA, QFN), voiding issues during the reflow...


The Necessity of Conducting Three Machine Tests During The SMT Production Process

09-10 | KingshengPCBA

SMT is the core of modern electronic manufacturing, characterized by miniature components, rapid assembly, and dense PCB routing. Once defects occur, not only are rework costs extremely high, but potential risks may also affect the reliability of...


The Classification Of PCB - KingSheng PCBA

08-27 | KingshengPCBA

Single sided board means the conductor pattern appears only on one side. Because single sided PCB has many strict limits. On trace design, only circuit at early stage use this kind of boards.


PCB Assembly Cost Modifiers In The Technology Cost Model - KingshengPCBA

08-27 | KingshengPCBA

The manufacturing plan for printed circuit boards - PCBA can change frequently. Some of the changes could be the batch run sizes, the work holder sizes, or the quality of the assembly process steps PCB assembly.


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