01-10 | Industry
BGA has a large pad package but the solder jointa is small. BGA layout design requirements 1.Place the PCB near the transfer side as close as possible. Because the deformation is relatively small during soldering.
01-10 | Industry
Printed circuit board (PCB) is one of the most common names, and can also be called "printed wiring boards" or "printed wiring cards". Before the PCB appeared, the circuit was made up of point-to-point wiring. The reliability of this method is very lo
01-10 | Industry
1. Considering the difference between product process and storage conditions, the printed board should be used in time (recommended within 24 hours) after unpacking, and it is recommended to pre-dry before use, especially the PI substrate in
01-10 | Industry
While in the PCB design the engineer will reserve positioning holes for printers and placement machines using. Different devices may have different requirements about positioning holes. Generally, a pair of positioning holes are required at both
01-10 | Industry
Main Tests in PCB Assembly Process-Frequently Asked Questions related to PCB assembly are those that are often tested after manufacturing. What needs to be done, however, is to design the test points when envisioned.
01-10 | Industry
The solder paste printing process mainly solves the problem of solder paste printing volume consistency (filling and transfer), not the problem of solder paste demand for each solder joint. In other words, the solder paste printing process solves the
01-10 | Industry
Flexible PCBs are easily deformed due to their thin and thin characteristics, so they cannot be directly assembled on SMT production lines like rigid PCBs. That is, in order to assemble the flexible PCB, the flexible PCB must be fixed on the substrate
01-10 | Industry
Although the recycling of electronic materials saves social resources well, there are still high risks. These refurbished materials may only deteriorate after being used for 1-2 years, because the use of materials also has a limited life time.
01-10 | Industry
In the PCB production process, the reservation of process edges is of great significance for subsequent SMT chip processing. The process side is to increase the part of the PCB board on the two or four sides of the PCB board.
01-10 | Industry
1. Wave soldering solder joint requirements: solder joints are full, shiny, not short of large area, short of tin, etc. 2. The flux spray method of wave soldering furnace is generally spray type.
01-10 | Industry
Convene R&D, quality, business depts to hold a project meeting and discuss specific implementation plans and precautions. After the discussion, the project manager arranges the division of responsibilities of each department,
01-10 | Industry
There are many reasons for the resistance process of the circuit board. During PCB fabrication, if the resistance is too high, it should be divided into the inner layer is too high or the outer layer is too high. In general, the reasons for operating
We would also like to thank our customers for their trust and support. The company's outstanding achievements are mainly due to the loyalty of our customers, which also encourages and spurs our company to forge ahead.
