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A high-frequency PCB (Printed Circuit Board) is manufactured using materials specifically designed for high-frequency applications. These boards are produced through advanced PCB manufacturing processes tailored to high-frequency materials.
High-frequency PCB design engineers define a high-frequency PCB as one that is used in high-frequency circuit applications. A high-frequency circuit is characterized by a frequency band exceeding 1GHz. These circuits consist of passive components, active devices, and passive networks. Key components in high-frequency circuits include high-frequency oscillators, transformers, resonators, and filters, which play crucial roles in signal transmission, frequency selection, and impedance transformation.
With the rapid advancement of technology, an increasing number of devices are being designed for applications operating above the microwave frequency band (greater than 1GHz) and into the millimeter-wave range (up to 30GHz). This trend places greater demands on high-frequency PCB substrates, requiring materials with exceptional electrical properties and good chemical stability. As power signal frequencies increase, the substrate must exhibit minimal signal loss. The emergence of 5G technology has further underscored the significance of high-frequency PCB materials.
1. Dielectric Constant (DK) and Dissipation Factor (DF): High-frequency PCBs should have small and stable DK and DF values, as lower values are preferable. A high DK can cause signal transmission delays, which negatively impacts signal quality, while a smaller DF helps reduce signal loss.
2. Thermal Expansion: The coefficient of thermal expansion of high-frequency PCBs should ideally match that of copper foil. A mismatch can lead to the separation of the copper foil during temperature fluctuations.
3. Water Absorption: In humid environments, high-frequency PCBs must have low water absorption levels. High water absorption can adversely affect the PCB's DK and DF properties.
4. Durability: High-frequency PCBs should possess good heat resistance, chemical resistance, impact resistance, and peel resistance.
1. Material Selection: The most commonly used high-frequency material is fluorine dielectric substrate, such as PTFE (Teflon) PCBs.
2. Adhesion Issues: Due to the nature of the materials, the adhesion of plated through-hole (PTH) copper on high-frequency PCBs may be inadequate. To improve adhesion between the PTH holes and solder resist ink, it is often necessary to roughen the surface using plasma treatment equipment.
3. Welding Considerations: High-frequency PCBs should not be ground before resistance welding. Grinding can lead to poor adhesion; instead, roughening should be accomplished through micro-etching solutions.
4. Cutting Techniques: Most high-frequency PCBs are made from Teflon materials. Using a standard milling cutter can result in numerous burrs, so a specialized milling cutter is required for optimal results.
5. Performance Requirements: High-frequency PCBs have stringent requirements regarding physical performance, accuracy, and technical specifications. They are commonly found in applications such as automotive collision avoidance systems, satellite systems, and radio systems.
6. Impedance Control: High-frequency PCBs have strict impedance control requirements, particularly concerning line width. The general tolerance for line width is approximately 2%.
KingshengPCBA is specializing in the production of Flexible Printed Circuit Boards (PCB) and offers design services for Flex PCB (FPC) layouts. Flex PCB are a type of circuit board that can be bent, folded, or twisted to fit into various shapes and applications where rigid boards are not suitable.We provide manufacturing services for Flex PCB, which involves the fabrication of circuit patterns on flexible substrates using advanced techniques such as etching, plating, and solder mask application. They offer expertise in designing and manufacturing Flex PCB to meet specific requirements, including size, shape, and functionality.
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