GET 20% OFF

Why choose us

  • list-ok Total 15 full automatic SMT lines
  • list-ok YAMAHA, SAMSUNG SMT & Testing Machine
  • list-ok Compliance to ISO9001, IPC and UL
  • list-ok One-stop SMT Assembly Service
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SMT assembly capacity

 
Full-automatic SMT Assembly Lines
 
Various Component Packages Available
 
  • BGA
  • SOIC
  • QFP
  • POP
  • QFN
  • PLCC
  • uBGA
Different Testing Services
 
  • Automated Optical Inspection
  • X-ray Testing
  • In-circuit Testing
  • Functional Testing

 

We offer One-stop SMT assemly

 

PCB Manufacturing

With our advanced SMT assembly lines, we can manufacture miniaturized assemblies and complex assemblies that require high-mix ratios and high-density Interconnect. We specialize in assembling various SMT PCBs and we can handle a variety of components with our automated SMT assembly lines such as passive chip components, active packages, and so on.

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Components Sourcing

We utilize highly automated SMT machines to ensure that we can always place surfaced mounted components in the right positions with a short turnaround time. Our assembly flexibility and advanced capabilities can meet all your requirements well.

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SMT Stencil

We are well-versed in PCB stencils and we have the expertise to help customers choose the right stencil that is suitable for their PCBs. By using the best stencil, there is less chance of errors in the process and performance can be improved as well.

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SMT Assembly Prototyping

Our professional engineering team customizes the design of the PCB prototype according to the project requirements, which greatly reduces the possibility of errors in the later stage. Ensure PCBA quality and speed up turnaround time with our SMT assembly prototyping services.

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SMT PCBA

With our advanced SMT assembly lines, we can manufacture miniaturized assemblies and complex assemblies that require high-mix ratios and high-density Interconnect. We specialize in assembling various SMT PCBs and we can handle a variety of components with our automated SMT assembly lines such as passive chip components, active packages, and so on.

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Item Capacity
Single and double sided SMT/PTH Yes
Large parts on both sides, BGA on both sides Yes
Smallest Chips size 01005
BGA type QFP QFN LGA CGA BGA PGA
Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000
Max process board size (mounting) 700mm*460mm
Min process board size (mounting) 50mm*50mm
Process type Any(Flexible,rigid-flex,HDI,Aluminum substrate)
Variable active and possitive components Metal/ Enclosure/ Housing parts/ Cable/wire/socket Yes
Wave soldering,conformal coating, Ultrasonic PCBA Cleaning Yes
Panelized PCB 1. Tab routed
2.Breakaway tabs
3. v-Scored
4.Routed+ V scored
Inspection 3D SPI&3D AOI,X-RAY
Test Capability Flying Probe Test, ICT, Functional test
Reliability Test YES( aging,humidity test, high and low temp,etc. )
Rework 1.BGA removal and replacement station
2. SMT IR rework station
3. Thru-hole rework station
Followed IPC Standard IPC-A-610 Class Ⅱ, Class Ⅲ

Online Support

24/7 hours'service

GET 30% OFF

On Your First PCB Assembly Order!