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About us
 Shenzhen KingshengPCBA Tech Co.,Ltd (HK C-Alley Co.,Ltd), an professional PCBA manufactuer and electronics manufacturing service (EMS) provider for 12years.SMT factory has ISO9001, ISO14001, TS16949 certification, advanced production equipment and rich experience in the production of PCBA. more

Worktime : 10:00-19:30 (Beijing time)

Website:      www.kingshengpcba.com

Contact Person : Sulin Huang

Business Telephone :+86-755-27442301

Mobile Phone: +86-13828766801

Skype :   kingsheng.pcba10

Email :   manager@c-alley.com

Factory Add:  Floor 2, Building 6, The 3rd Industrial Zone of Tangtou, Shiyan, Baoan District,Shenzhen,GuangDong,China 518108

PCB surface finish- HASL, ENIG, OSP
PCB surface finish- HASL, ENIG, OSP 
Now the commonly used circuit board surface finish are HASL, ENIG, OSP. The following are the advantages and disadvantages of the three different surface finish.
The advantages of Lead HASL: lower price, excellent welding performance, better mechanical strength.
Disadvantages of Lead HASL: Lead HASL cannot pass ROHS and other environmental protection evaluations.
The advantages of Lead-free HASL: low price, excellent welding performance, and relatively environmentally friendly, can pass ROHS and other environmental protection evaluation.
Disadvantages of Lead-free HASL: mechanical strength, gloss, etc. are not as good as lead-free spray tin.
The common disadvantage of HASL: it is not suitable for high precision chips.
Immersion gold process is a relatively advanced surface treatment process, which is mainly used on circuit boards with functional connection requirements and long storage periods on the surface.
Advantages of ENIG: It is not easy to oxidize, can be stored for a long time, and has a flat surface. It is suitable for soldering high precision components. Reflow can be repeated many times without reducing its solderability.
Disadvantages of ENIG: high cost, poor welding strength. The nickel layer oxidizes over time, and long-term reliability is an issue.
3. OSP
OSP is an organic film formed by chemical means on the surface of bare copper. This layer of film has anti-oxidation, thermal shock resistance, moisture resistance, and is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) in the normal environment; this process is suitable for low-tech circuit boards and high-tech circuits. For boards, if there are no surface connection functional requirements or shelf life restrictions, the OSP process will be the most ideal surface treatment process.
Advantages of OSP: It has all the advantages of bare copper board soldering, and boards that have expired (three months) can also be resurfaced, but usually only once.
Disadvantages of OSP: susceptible to acid and humidity. When used for secondary reflow soldering, it needs to be completed within a certain period of time. Usually, the effect of the second reflow soldering will be poor. If the storage time exceeds three months, it must be resurfaced. Use within 24 hours after opening the package.