PCB Manufacturing Process Analysis

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(A) Production Process
PCB manufacturing process is more complex, mainly including substrate processing, line pattern transfer, etching, copper plating, solder resist printing, silk screen, and other steps. First of all, the substrate is cleaned and pre-treated to ensure a good combination of copper foil and substrate; then, the designed line pattern is transferred to the copper foil through photolithography; then, the etching solution is used to remove unwanted copper foil to form a conductive line; and then copper plating is carried out to increase the conductivity and strength of the line; and then the soldermask and silkscreen layer are printed in turn.

PCB Manufacturing

(B) Key Processes
Multi-layer board pressing: For multi-layer boards, it is necessary to press the inner and outer layers of multiple boards. In the process of pressing, the temperature, pressure, and time should be controlled to ensure that the layers are closely combined and the insulation between the layers is good.
Microvia Processing: With the miniaturization and high performance of electronic products, the microvia processing requirements for PCBs are getting higher and higher. Commonly used microvia processing methods include laser drilling, mechanical drilling, etc. Laser drilling has the advantages of high precision, high speed, small aperture, etc., and is suitable for high-density interconnect (HDI) board manufacturing.

(C) Quality Control
In the PCB manufacturing process, quality control is maintained throughout. Through online inspection, flying pin test, automatic optical inspection (AOI), and other means, each process is strictly controlled, and timely detection and resolution of problems ensure product quality in line with standards.

Why Choose China PCBA Supplier KSPCBA as Your PCB Manufacturer?

– Experienced and skilled team

– State-of-the-art equipment

– Strict quality control

– Excellent customer service

– Competitive price