* On your first PCB Assembly order!
* Up to $300 discount
Total 15 full automatic SMT lines YAMAHA, SAMSUNG SMT & Testing Machine Compliance to ISO9001, IPC and UL One-stop SMT Assembly Service
10 million chips per day (0402, 0201 with 8 million per day) Reflow Soldering Automatic Wave Soldering System Automatic Plug-in Machines BGA Rework Machine
With our advanced SMT assembly lines, we can manufacture miniaturized assemblies and complex assemblies that require high-mix ratios and high-density Interconnect. We specialize in assembling various SMT PCBs and we can handle a variety of components with our automated SMT assembly lines such as passive chip components, active packages, and so on.
We utilize highly automated SMT machines to ensure that we can always place surfaced mounted components in the right positions with a short turnaround time. Our assembly flexibility and advanced capabilities can meet all your requirements well.
We are well-versed in PCB stencils and we have the expertise to help customers choose the right stencil that is suitable for their PCBs. By using the best stencil, there is less chance of errors in the process and performance can be improved as well.
Our professional engineering team customizes the design of the PCB prototype according to the project requirements, which greatly reduces the possibility of errors in the later stage. Ensure PCBA quality and speed up turnaround time with our SMT assembly prototyping services.
With our advanced SMT assembly lines, we can manufacture miniaturized assemblies and complex assemblies that require high-mix ratios and high-density Interconnect. We specialize in assembling various SMT PCBs and we can handle a variety of components with our automated SMT assembly lines such as passive chip components, active packages, and so on.
| Item | Capacity |
| Single and double sided SMT/PTH | Yes |
| Large parts on both sides, BGA on both sides | Yes |
| Smallest Chips size | 01005 |
| BGA type | QFP QFN LGA CGA BGA PGA |
| Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
| Max process board size (mounting) | 700mm*460mm |
| Min process board size (mounting) | 50mm*50mm |
| Process type | Any(Flexible,rigid-flex,HDI,Aluminum substrate) |
| Variable active and possitive components Metal/ Enclosure/ Housing parts/ Cable/wire/socket | Yes |
| Wave soldering,conformal coating, Ultrasonic PCBA Cleaning | Yes |
| Panelized PCB | 1. Tab routed 2.Breakaway tabs 3. v-Scored 4.Routed+ V scored |
| Inspection | 3D SPI&3D AOI,X-RAY |
| Test Capability | Flying Probe Test, ICT, Functional test |
| Reliability Test | YES( aging,humidity test, high and low temp,etc. ) |
| Rework | 1.BGA removal and replacement station 2. SMT IR rework station 3. Thru-hole rework station |
| Followed IPC Standard | IPC-A-610 Class Ⅱ, Class Ⅲ |
We would also like to thank our customers for their trust and support. The company's outstanding achievements are mainly due to the loyalty of our customers, which also encourages and spurs our company to forge ahead.
