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BGA PCB Assembly
What is BGA PCB assembly? BGA assembly refers to the process of mounting a Ball Grid Array (BGA) onto a PCB using the reflow soldering technique. BGA assembly is a process of mounting ball grid arrays onto a PCB using the solder reflow process. They are surface-mount components that use arrays of solder balls to make electrical interconnections. These solder balls melt and establish interconnection when the board passes through the solder reflow oven.
BGA PCB Manufacture
Kingsheng BGA (Ball Grid Array) Assembly is a process used for assembling electronic components onto PCBs using ball grid array technology. BGA technology involves attaching the component to the board using arrays of small solder balls instead of through-hole pins.This allows for a high density of connections in a small area, making it suitable for applications such as microprocessors, memory modules, and graphics chips.
Kingsheng's BGA assembly service uses advanced equipment and techniques to ensure high precision and reliability. They use automated optical inspection (AOI), X-ray inspection, and other testing methods to detect any defects or faults in the assembly process.
KSPCBA BGA Assembly is a technology used in the manufacture of electronic products. BGA (Ball Grid Array) is a surface mount technology commonly used in the installation of integrated circuits (ICS) and other electronic components. During BGA assembly, the pins of the electronic components are connected to a spherical solder joint grid on the printed circuit board (PCB) to provide a reliable electrical connection.
Our BGA Assembly provides efficient and accurate BGA component assembly services. This assembly process involves several steps, including PCB preparation, spherical solder joint coating, component positioning, hot air welding, and testing. The professional team at C-Alley BGA Assembly has the experience and know-how to ensure the high quality and reliability of the assembly process.
Why Choose China PCBA Supplier KSPCBA as Your BGA PCB Manufacture/BGA PCB Assembly Manufacturer?
– Experienced and skilled team
– State-of-the-art equipment
– Strict quality control
– Excellent customer service
– Competitive price
How can we make high quality PCBA products?
Strict incoming material inspection control and management.
Never change BOM indicated material brand without customer’s permission.
Standard Operation Procedure
PCB will be baked in the oven machine in advance.
Fully automatic, high precision SMT and test equipment.
Comprehensive testing include AOI,X-Ray,ICT,software burning according to different PCBAs.
Strict quality management system.
Please send Email to kspcba@c-alley.com or call us through +86 13794451450 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.